Physical properties of the cured adhesives:

• Very elastic
• Low strength
• Can be used from -100 to +200 °C; short periods up to 300 °C
• Excellent resistance to weathering
• Some susceptible to mould
• Cannot be lacquered/painted

Processing:

• Manual, semi-automated or fully automated processing
• For preferred equipment contact the adhesive manufacturer
• Curing conditions: +5 °C to +40 °C, 5 – 95 % relative humidity
• Liberation of cleavage products (e.g. acetic acid) during the curing
• Normal contact pressure; for very firm adhesives, no positioning/sec‌uring necessary
• Curing from outside to inside
• Heed the skinning time!
• Curing from the outside to the inside; several mm per day; initially fast, then slower depending on the available humidity/moisture
• Adhesive film thickness: 5 – 25 mm
• Take relevant measures for health and safety at work and environmental protection (General: see Section 7; Details: see safety data sheet)

Processing:

• Manual, semi-automated or fully automated processing
• For preferred equipment contact the adhesive manufacturer
• Processing temperature: room temperature
• Normal contact pressure; for very firm adhesives, no positioning/sec‌uring necessary
• Adhesive film thickness: in general 5 – 25 mm
• Curing at temperatures up to 150 °C in 15 to 30 seconds
• Secure in position during the entire oven process
• Very low shrinkage (ca. 0.1 %)
• Take relevant measures for health and safety at work and environmental protection (General: see Section 7; Details: see safety data sheet))

Points to heed:

• Ensure the substrates have adequate thermal stability
• Take into account the heating-up time and cooling-down time for the substrates; this time must be added to the curing time for the adhesive
  → Take special care with thick substrates
• The heating temperature refers to the temperature in the joint
  → Take special care with thick substrates
• Stresses can develop in the bonded joint on heating up and cooling down; Only remove the positioning/sec‌uring device after reaching hand strength 

Processing:

• Manual, semi-automated or fully automated processing
• For preferred equipment contact the adhesive manufacturer
• Processing temperature: room temperature
• Normal contact pressure; for very firm adhesives: no positioning/sec‌uring necessary
• Adhesive film thickness: usually: 5 – 25 mm; sometimes less
• Curing by mixing the resin and hardener: at room temperature independent of the air humidity
• Heed the mixing ratio
• Thorough mixing absolutely essential, but avoid the incorporation of air bubbles
• Heed the pot life / processing time
• Curing times: up to 24 hours at room temperature
• Secure until the bonded joint has reached hand strength
• Take relevant measures for health and safety at work and environmental protection (General: see Section 7; Details: see safety data sheet)

Points to heed:

• Heed the mixing ratio
• Thorough mixing absolutely essential, but avoid the incorporation of air bubbles
• Once the pot life  has lapsed, do not use any more of the adhesive and dispose of any unused adhesive in the proper way!
• Once the pot life  has lapsed, the position of the bonded substrates may not be further altered
• Heed the curing time
• The cleavage products may affect the substrates

Processing properties:

• Manual, semi-automated or fully automated processing
• For preferred equipment contact the adhesive manufacturer
• Processing temperature: room temperature
• Normal contact pressure; for very firm adhesives, no positioning/sec‌uring necessary
• Adhesive film thickness: usually 0.2 – 25 mm
• Curing method: at room temperature (+5 °C to +40 °C) with air humidity (30 – 95 % rel. humidity)
• Curing from outside to inside
• Heed the skinning time!
• The skinning time  is the processing time of the non-cured adhesive
• Curing time: several mm in the first 24 hours, then slower; depends on the available humidity/moisture
• Secure until the bonded joint has reached hand strength
• Take relevant measures for health and safety at work and environmental protection (General: see Section 7; Details: see safety data sheet)

Typical properties of the cured adhesives:

• Flexible-elastic, medium elongation at frature
• Medium strength
• Use at temperatures from -40 °C to max. +100 °C
• Moderate UV protection
• Broad adhesion spectrum
• Coating/lacquering only wet-in-wet, otherwise pretreatment necessary
• Repair-bonding on cut open beads only possible for some systems
• Can only be smoothed to a limited extent

Points to heed:

• The joining process and sec‌uring must be completed prior to the end of the skinning time
• Once the skinning life has lapsed, the position of the bonded substrates may not be further altered
• The cleavage products may affect the substrates (corrosion, stress cracking)

Processing properties:

• Manual, semi-automated or fully automated processing
• For preferred equipment contact the adhesive manufacturer
• Processing temperature: room temperature
• Select the correct contact pressure
• Adhesive film thickness: usually 0.1 – 0.2 mm
• Curing at 100 – 180 °C under pressure in a few hours
• Pressure to avoid water vapour bubbles in the adhesive film
• Secure in position during the entire oven process
• Take relevant measures for health and safety at work and environmental protection (General: see Section 7; Details: see safety data sheet)

Typical properties of the cured adhesives:

• High  strength
• Brittle, low  elongation at frature
• Temperature for continuous use: up to ca. 180 °C, some also higher
• Very good  resistance to moisture and chemicals
• Very good  adhesion and long-term stability on oxidatively etched aluminium surfaces, steel, stainless steel, and friction linings

Points to heed:

• Check the thermal stability of the substrates prior to curing (in an oven)
• Take into account the heating-up time and cooling-down time for the substrates; this time must be added to the
• curing
•  time for the adhesive
  → Take special care with thick substrates
• The heating temperature refers to the temperature in the joint
  → Take special care with thick substrates
• Stress can develop in the joint on heating and cooling

Processing properties:

• Manual, semi-automated or fully automated processing
• For preferred equipment contact the adhesive manufacturer
• Processing temperature: room temperature
• Normal contact pressure
• Adhesive film thickness: usually 0.1 – 0.2 mm
• Storage at room temperature, store unstable precursors at -20 °C
• Processing of the precursors often from solution (DMF, DMAC)
• Evaporation of the solvent at ca. 100 °C
• Curing temperature: 230 °C to 250 °C in the oven; pressure: 0.8 to 1 MPa
• For some products: post-curing at 300 – 400 °C
• Secure in position during the entire oven process
• Take relevant measures for health and safety at work and environmental protection (General: see Section 7; Details: see safety data sheet)