8.2.5 Joining and sec‌uring2019-05-03T13:04:52+02:00

8.2.5 Joining and sec‌uring

  • Avoid non-uniform adhesive film thicknesses (the acceptable margin varies widely depending on the adhesive)
  • Prevent the components slipping sideways
  • Select a suitable positioning device to sec‌ure the substrates in position
  • Uniform contact pressure
  • Secure until the substrates reach handstrength