Processing properties:

• Manual, semi-automated or fully automated processing
• For preferred equipment contact the adhesive manufacturer
• Processing temperature: room temperature, usually between 15 – 30 °C
• Normal contact pressure
• Adhesive film thickness: 0.1 – 0.2 mm, higher for some applications
• Curing method: on mixing the resin and hardener; at room temperature or with heat input
• Heed the processing time / pot life
• The pot life is limited and describes the maximum processing time of the non-cured adhesive. It is indicated on the technical data sheet.
• Curing times: from a few hours to days at RT; faster with heat input
• Secure until the bonded joint has reached hand strength
• Take relevant measures for health and safety at work and environmental protection (General: see Section 7; Details: see safety data sheet)

Typical properties of the cured adhesives:

• High strength
• In general brittle with low elongation at fracture ; tough-elastic products also available
• The cured adhesive is stable at elevated temperatures (up to ca. 120 °C), for short periods (30 min) stable to 200 °C
• Good resistance to physical influences (e.g. sunlight) and chemical influences (moisture, cleaning agents, chemicals, etc.).

Points to heed:

• Heed the mixing ratio
• Mix thoroughly following the instructions of the manufacturer; if possible the use of a static or dynamic mixer is preferred to manual mixing; avoid bubble formation
• The processing time / pot life depend on the ambient temperature, quantity of mixture and the particular adhesive product
• Once the pot life has lapsed, do not use any more of the adhesive and dispose of any unused adhesive in the proper way! Large quantities of mixed adhesive can spontaneously combust.
• Once the pot life has lapsed, the position of the bonded substrates may not be further altered
• Heed the curing time

When curing with heat the following points must be heeded:

• Ensure the substrates have adequate thermal stability
• Take into account the heating-up time and cooling-down time for the substrates; this time must be added to the curing time for the adhesive
• The heating temperature refers to the temperature in the joint
• Stress can develop in the joint on heating and cooling

If you have questions about the product then see the technical data sheet or contact the adhesive manufacturer

Points to heed:

• Check the thermal stability of the substrates prior to curing (in an oven)
• Take into account the heating-up time and cooling-down time for the substrates; this time must be added to the curing time for the adhesive
  → Take special care with thick substrates
• The heating temperature refers to the temperature in the joint
  → Take special care with thick substrates
• Stress can develop in the joint on heating and cooling

If you have questions about the product then see the technical data sheet or contact the adhesive manufacturer

Processing properties:

• Manual, semi-automated or fully automated processing
• For preferred equipment contact the adhesive manufacturer
• Processing at room temperature
• Adhesive film thickness: usually: 5 – 25 mm; sometimes less
• For very firm products, hardly any contact pressure is necessary; sec‌uring the components against one another suffices
• Curing method: on mixing the resin and hardener; at room temperature or with heat input
• Heed the processing time / pot life
• The pot life is limited and describes the maximum processing time of the non-cured adhesive. It is indicated on the technical data sheet.
• Curing times: from a few hours to days at RT
• Acceleration with heat
• Secure in position until the bonded joint has reached hand strength
• Take relevant measures for health and safety at work and environmental protection (General: see Section 7; Details: see safety data sheet)

Processing properties:

• Manual, semi-automated or fully automated processing
• For preferred equipment contact the adhesive manufacturer
• Processing temperature: room temperature
• Normal contact pressure; for very firm adhesives: no positioning/sec‌uring necessary
• Adhesive film thickness: in general 5 – 25 mm
• Curing method: at room temperature with air humidity (40 – 80 % rel. humidity)
• Curing from outside to inside
• Heed the skinning time!
• The skinning time is the processing time of the non-cured adhesive
• Curing time: several mm in the first 24 hours, then slower; depends on the available humidity/moisture
• Secure until the bonded joint has reached hand strength
• Certain products allow accelerated and uniform curing via the introduction of moisture (booster systems)
• Take relevant measures for health and safety at work and environmental protection (General: see Section 7; Details: see safety data sheet)

Points to heed:

• Heed the required humidity limit at the workplace when processing the adhesives (see the technical data sheet)
• Usually process in combination with a primer
• Once the processing time / skinning time has lapsed, do not further process any more of the adhesive and dispose of any unused adhesive in the proper way!
• Once the processing time / skinning time has lapsed, the position of the bonded substrates may not be further altered

Processing properties:

• Manual, semi-automated or fully automated processing
• For preferred equipment contact the adhesive manufacturer
• Processing temperature: room temperature
• Normal contact pressure; for very firm adhesives no positioning/sec‌uring necessary
• Adhesive film thickness: usually: 5 – 25 mm; sometimes less
• Application at high temperatures (50 – 100 °C) as a melt;  hand strength reached on cooling provides suitable positional integrity and  resistance to washing out for subsequent processing steps (e.g. coating/lacquering)
• Final curing via air humidity (40 – 70 % rel. humidity); several mm/day
• Take relevant measures for health and safety at work and environmental protection (General: see Section 7; Details: see  safety data sheet